Photoresist Processing Trouble-Shooting Etchants and Solvents
Photoresists Ancillaries Storage/Handling/Ageing Substrate Pre-Treatment and Coating Baking Steps Exposure Development Coating and Lift-off Etching and Stripping
Exposure Wavelengths, Spectral Sensitivities, Doses Rehydration Exposure Dose: Too low/too high? Bleaching Resolution Limits Some Chemistry: The Photoreaction
With optimized processing, the photo resist applied limits the possible resolution/feature size. Dependant on the film thickness, AZ® photoresists allow a resolution below 0.5 micron. Examples for high-resolution resists are the thin resist AZ® MiR 701, the thick resist AZ® 9260, the image reversal resist AZ® 5214E, and the negative resist AZ® nLOF 2000.

The exposure wavelength is far less important for a high resolution than often expected: Comparing g- and i-line, the theoretical resolution changes by less than 10% (relative) when using i-line (365 nm) instead of g-line (435 nm).

A good contact between mask and resist film is much more important for attaining optimum resolution results: An undesired "gap" (e.g. by particles/bubbles in the resist film) significantly impacts on the possible feature sizes.

A sufficient softbake reduces the remaining solvent concentration in the resist film and therefore the dark erosion during development, which again improves the possible resolution.

A developer concentration too high as well as using expired developers (longer necessary development time) reduces the selectivity of the developer which deteriorates the possible resolution of the photoresist.
e-Mail Anfrage Product request: AZ 701MiR high-Resolution thin Resist e-Mail Anfrage Product request: AZ 9260 high-Resolution thick Resist e-Mail Anfrage Product Request: AZ 5214E high-Resolution Image Reversal Resist e-Mail Anfrage Product request: AZ nLOF 2000 high-Resolution negative Resist  Softbake
MicroChemicals« - All you need for microstructuring with short lead times also in small sales volumes:

Photoresists (positive, negative, image reversal, thin and thick resists, spray resists, protective coating ...)
Ancillaries ( developers, thinner, adhesion promoter such as HMDS, remover)
Etchants (acids and the ready-to-use etching mixtures aluminium etch, chromium etch, gold etch und silicon etch)
Solvents (acetone, isopropyl alcohol, MEK ... in VLSI and ULSI quality)