Photoresist Processing Trouble-Shooting Etchants and Solvents
Photoresists Ancillaries Storage/Handling/Ageing Substrate Pre-Treatment and Coating Baking Steps Exposure Development Coating and Lift-off Etching and Stripping
Developers (Metal Ion Containing) Developers (Metal Ion Free) Remover/Stripper Adhesion Promoter/Thinner/Edge Bead Removal Compatibilities
AZ® 326 MIF is 2.38% TMAH (TetraMethylAmmoniumHydroxide) in H2O.

AZ® 726 MIF is 2.38% TMAH in H2O, with additional surfactants for fast and homogenous substrate wetting.

AZ® 826 MIF is 2.38% TMAH in H2O, with additional surfactants for fast and homogenous substrate wetting, and further additives for removal of resist residuals sometimes occuring after development. This "scum-remover", causes a slightly higher dark erosion, but is required for development of the photoresists AZ® 4533 and 4562 if metal ion free developers have to be used.
e-Mail Anfrage MIF developers Weiterführendes Dokument (pdf) Photoresist Development Weiterführendes Dokument (pdf) Compatibilities (Resists and Developers)  Development
MicroChemicals® - All you need for microstructuring with short lead times also in small sales volumes:

Photoresists (positive, negative, image reversal, thin and thick resists, spray resists, protective coating ...)
Ancillaries ( developers, thinner, adhesion promoter such as HMDS, remover)
Etchants (acids and the ready-to-use etching mixtures aluminium etch, chromium etch, gold etch und silicon etch)
Solvents (acetone, isopropyl alcohol, MEK ... in VLSI and ULSI quality)