Photoresist Processing Trouble-Shooting Etchants and Solvents
Photoresists Ancillaries Storage/Handling/Ageing Substrate Pre-Treatment and Coating Baking Steps Exposure Development Coating and Lift-off Etching and Stripping
Positive/Negative/Image Reversal Chemical Stability Thermal Stability Optical Properties Solvent The Resin The Photo Active Compound
The resin of our AZ® and TI photoresists is novolak, a cresole resin which is polymerized from formaldehyde und phenol. The Novolak molecular chain length determines many properties of the resist: Long chains increase the thermal stability (softening point), decrease the dark erosion in developer as well as the development rate of exposed resist. Short chains increase the resist adhesion to the substrate. Therefore, resists contain a certain chain length distribution (typically: 8 to 20 monomer units).
MicroChemicals« - All you need for microstructuring with short lead times also in small sales volumes:

Photoresists (positive, negative, image reversal, thin and thick resists, spray resists, protective coating ...)
Ancillaries ( developers, thinner, adhesion promoter such as HMDS, remover)
Etchants (acids and the ready-to-use etching mixtures aluminium etch, chromium etch, gold etch und silicon etch)
Solvents (acetone, isopropyl alcohol, MEK ... in VLSI and ULSI quality)